WO2016064380A1 - Pseudo resistance circuit and charge detection circuit - Google Patents

Pseudo resistance circuit and charge detection circuit Download PDF

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Publication number
WO2016064380A1
WO2016064380A1 PCT/US2014/061669 US2014061669W WO2016064380A1 WO 2016064380 A1 WO2016064380 A1 WO 2016064380A1 US 2014061669 W US2014061669 W US 2014061669W WO 2016064380 A1 WO2016064380 A1 WO 2016064380A1
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WIPO (PCT)
Prior art keywords
mosfet
source
voltage
gate
current
Prior art date
Application number
PCT/US2014/061669
Other languages
French (fr)
Inventor
Shumpei IDA
Hae-Sung Lee
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Murata Manufacturing Co., Ltd.
Massachusetts Institute Of Technology
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Filing date
Publication date
Application filed by Murata Manufacturing Co., Ltd., Massachusetts Institute Of Technology filed Critical Murata Manufacturing Co., Ltd.
Priority to JP2017518464A priority Critical patent/JP6328849B2/en
Priority to PCT/US2014/061669 priority patent/WO2016064380A1/en
Priority to EP14904519.7A priority patent/EP3210215B1/en
Priority to CN201480082684.2A priority patent/CN106796833B/en
Publication of WO2016064380A1 publication Critical patent/WO2016064380A1/en
Priority to US15/484,397 priority patent/US10187041B2/en

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Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H11/00—Networks using active elements
    • H03H11/46—One-port networks
    • H03H11/53—One-port networks simulating resistances; simulating resistance multipliers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R29/00—Arrangements for measuring or indicating electric quantities not covered by groups G01R19/00 - G01R27/00
    • G01R29/24—Arrangements for measuring quantities of charge
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03F—AMPLIFIERS
    • H03F3/00—Amplifiers with only discharge tubes or only semiconductor devices as amplifying elements
    • H03F3/45—Differential amplifiers
    • H03F3/45071—Differential amplifiers with semiconductor devices only
    • H03F3/45076—Differential amplifiers with semiconductor devices only characterised by the way of implementation of the active amplifying circuit in the differential amplifier
    • H03F3/45475—Differential amplifiers with semiconductor devices only characterised by the way of implementation of the active amplifying circuit in the differential amplifier using IC blocks as the active amplifying circuit
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/20—Modifications of basic electric elements for use in electric measuring instruments; Structural combinations of such elements with such instruments
    • G01R1/203—Resistors used for electric measuring, e.g. decade resistors standards, resistors for comparators, series resistors, shunts
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05F—SYSTEMS FOR REGULATING ELECTRIC OR MAGNETIC VARIABLES
    • G05F3/00—Non-retroactive systems for regulating electric variables by using an uncontrolled element, or an uncontrolled combination of elements, such element or such combination having self-regulating properties
    • G05F3/02—Regulating voltage or current
    • G05F3/08—Regulating voltage or current wherein the variable is dc
    • G05F3/10—Regulating voltage or current wherein the variable is dc using uncontrolled devices with non-linear characteristics
    • G05F3/16—Regulating voltage or current wherein the variable is dc using uncontrolled devices with non-linear characteristics being semiconductor devices
    • G05F3/20—Regulating voltage or current wherein the variable is dc using uncontrolled devices with non-linear characteristics being semiconductor devices using diode- transistor combinations
    • G05F3/26—Current mirrors
    • G05F3/265—Current mirrors using bipolar transistors only
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03F—AMPLIFIERS
    • H03F3/00—Amplifiers with only discharge tubes or only semiconductor devices as amplifying elements
    • H03F3/04—Amplifiers with only discharge tubes or only semiconductor devices as amplifying elements with semiconductor devices only
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03F—AMPLIFIERS
    • H03F3/00—Amplifiers with only discharge tubes or only semiconductor devices as amplifying elements
    • H03F3/34—Dc amplifiers in which all stages are dc-coupled
    • H03F3/343—Dc amplifiers in which all stages are dc-coupled with semiconductor devices only
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03F—AMPLIFIERS
    • H03F3/00—Amplifiers with only discharge tubes or only semiconductor devices as amplifying elements
    • H03F3/34—Dc amplifiers in which all stages are dc-coupled
    • H03F3/343—Dc amplifiers in which all stages are dc-coupled with semiconductor devices only
    • H03F3/345—Dc amplifiers in which all stages are dc-coupled with semiconductor devices only with field-effect devices

Definitions

  • the present invention relates to a pseudo resistance circuit and a charge detection circuit.
  • Patent Document 1 discloses a charge detection circuit in which a capacitor and a resistor connected in parallel are provided between an output terminal and an input terminal of an operational amplifier.
  • Patent Document 2 discloses a configuration in which a weak inversion region of a MOSFET is used to form a resistor having a large resistance value.
  • Patent Document 2 discloses a configuration in which a weak inversion region of a MOSFET is used to form a resistor having a large resistance value.
  • Document 3 discloses a configuration in which the gate voltage of a MOSFET is adjusted using a plurality of current sources having temperature dependence, thereby suppressing temperature dependence of the drain current of the MOSFET.
  • Patent Document 1 Japanese Patent Application Laid-Open No. 2008-224230
  • Patent Document 2 International Publication No. 95/25349
  • Patent Document 3 PCT Japanese Translation Patent
  • a pseudo resistance circuit capable of suppressing fluctuation in resistance value with fluctuation in process or temperature and facilitating adjustment.
  • a pseudo resistance circuit according to an aspect of the invention is described that includes a first MOSFET, a second MOSFET, a first current source which generates a first current substantially proportional to absolute temperature, and a voltage source which generates a first voltage, which is a substantially linear function of absolute temperature, in which the gate of the first MOSFET and the gate of the second MOSFET are connected together, the second MOSFET is diode-connected, the first current is supplied to the drain of the second MOSFET, the first voltage is applied to the source of the second MOSFET, and a resistor having a resistance value according to the gate voltage of the first MOSFET is formed between the drain and the source of the first MOSFET.
  • Fig. 1 is a diagram illustrating a configuration example of a pseudo resistance circuit according to an embodiment of the invention.
  • Fig. 2 is a diagram illustrating configuration examples of a current source and a voltage source of the circuit shown in Fig. 1 .
  • Fig. 3 is a diagram illustrating a resistance value when focusing only on an N-channel MOSFET.
  • Fig. 4 is a diagram illustrating a resistance value when focusing on an N-channel MOSFET and a current source.
  • Fig. 5 is a diagram illustrating a configuration example of a charge detection circuit according to an embodiment of the invention.
  • FIG. 1 is a diagram illustrating a configuration example of a pseudo resistance circuit according to an embodiment of the invention.
  • a pseudo resistance circuit 100 includes N-channel MOSFETs 1 10 and 120, a current source 130, and a voltage source 140.
  • the N-channel MOSFET 1 10 (second MOSFET) is diode- connected, and the gate thereof is connected to the gate of the N-channel MOSFET 120.
  • a current I PTAT from the current source 130 is supplied to the drain of the N-channel MOSFET 1 10.
  • a voltage V b i as from the voltage source 140 is applied to the source of the N-channel MOSFET 1 10.
  • the gate of the N-channel MOSFET 1 20 (first MOSFET) is connected to the gate of the N-channel MOSFET 1 0.
  • the N-channel MOSFET 1 20 operates in a weak inversion region, whereby a resistor having a resistance value R eff according to a gate voltage V G is formed between the drain and the source of the N-channel MOSFET 1 20.
  • the current source 1 30 generates the current I PT AT (first current) substantially proportional to absolute temperature.
  • I PT AT first current
  • a configuration example of the current source 1 30 will be described below.
  • the voltage source 140 generates the voltage V b i as (first voltage), which is a substantially linear function of absolute temperature.
  • V S of the N-channel MOSFET 1 20 V C M
  • T absolute temperature
  • Fig. 2 is a diagram illustrating configuration examples of the current source 1 30 and the voltage source 140 of the circuit 1 00 shown in Fig. 1 .
  • the current source 1 30 includes a current source 21 0 and a P-channel MOSFET 220.
  • the current I PT AT is output from the drain of the P-channel MOSFET 220.
  • the current source 210 (third current source) includes N-channel MOSFETs 230 and 231 , P-channel MOSFETs 232 and 233, and a resistor 234.
  • An output current of the current source 210 is a current I D S2 (third current) of the N-channel MOSFET 231 .
  • the N-channel MOSFET 230 is diode- connected, and the source thereof is grounded.
  • the gate of the N-channel MOSFET 231 is connected to the gate of the N-channel MOSFET 230, and the source of the N-channel MOSFET 231 is grounded through the resistor 234.
  • the size ratio of the N-channel MOSFETs 230 and 231 is, for example, 1 :n PT AT-
  • the P-channel MOSFET 232 is configured such that a power supply voltage V D D is applied to the source, the drain is connected to the drain of the N-channel MOSFET 230, and the gate is connected to the gate of the P- channel MOSFET 233.
  • the P-channel MOSFET 233 is diode-connected and is configured such that the power supply voltage V D D is applied to the source, and the drain is connected to the drain of the N-channel MOSFET 231 .
  • the P- channel MOSFET 220 is configured such that the power supply voltage V D D is applied to the source, and the gate is connected to the gate of the P-channel MOSFET 233.
  • the size ratio of the P-channel MOSFETs 232, 233, and 220 is, for example, 1 : 1 : 1/n.
  • k is a Boltzmann constant
  • T is absolute temperature
  • q is an electronic charge
  • ⁇ is a ⁇ approximated parameter
  • l D si is a current which flows in the N-channel MOSFET 230
  • l 0 si is a current according to the size of the N-channel MOSFET 230.
  • the voltage V G si is also the gate voltage of the N-channel MOSFET 231 and can be thus expressed by Expression (2).
  • V G s2 is the gate-source voltage of the N-channel MOSFET 231 .
  • IDS2 is a current which flows in the N-channel MOSFET 231 , that is, an output current of the current source 21 0.
  • RPTAT is the resistance value of the resistor 234.
  • Expression (3) is derived from Expressions (1 ) and (2).
  • los2 is a current according to the size of the N-channel
  • IDS2 is expressed by Expression (4).
  • a current which flows in the N-channel MOSFET 231 is l DS2 .
  • the P-channel MOSFET 220 is connected to the P- channel MOSFET 233 in a current mirror configuration, and thus the current ⁇ is expressed by Expression (5).
  • the current I PT AT which is output from the current source 130 is a current which is substantially proportional to absolute temperature.
  • the voltage source 140 includes a resistor 240 and a current source 250.
  • the resistor 240 (first resistor) is configured such that a voltage VCM (second voltage: the substantially same voltage as the source voltage of the N-channel MOSFET 120) is applied to one end, and the other end is connected to the drain of the N-channel MOSFET 261 .
  • VCM second voltage: the substantially same voltage as the source voltage of the N-channel MOSFET 120
  • the current source 250 (second current source) includes N-channel MOSFETs 260 and 261 , and a P-channel MOSFET 262.
  • a current which flows in the N-channel MOSFET 261 becomes an output current I PT AT2 (second current).
  • the N-channel MOSFET 260 is diode-connected and is configured such that the drain is connected to the drain of the P-channel MOSFET 262, and the source is grounded.
  • the N-channel MOSFET 261 is configured such that the gate is connected to the gate of the N-channel MOSFET 260, and the source is grounded.
  • the size ratio of the N-channel MOSFETs 260 and 261 is, for example, 1 :1/n bias .
  • the P-channel MOSFET 262 is configured such that the power supply voltage V D D is applied to the source, and the gate is connected to the gate of the P-channel MOSFET 233.
  • the size ratio of the P-channel MOSFETs 233 and 262 is, for example, 1 :1 .
  • the current source 250 generates the current IPTAT2 substantially proportional to the absolute
  • I PT AT2 (1 / n ias )lDS2- Accordingly, if the resistance value of the resistor 240 is R b i as , the voltage V b i as is expressed by Expression (6).
  • A is a constant.
  • V G s is the gate-source voltage of the N-channel MOSFET 120
  • V D s is the drain-source voltage of the N-channel MOSFET 120. los is a current according to the size of the N-channel MOSFET 120 and is expressed by Expression (8).
  • ⁇ is electron mobility
  • C ox is oxide capacity per unit area
  • W is a channel width
  • L is a channel length
  • K sa is a ⁇ approximated parameter in a weak inversion region
  • V T s is a threshold voltage
  • Expression (9) includes temperature T.
  • Expression (9) also includes a threshold voltage V T s which fluctuates with a process. Accordingly, in the pseudo resistance circuit 1 00 of this embodiment, as described below, fluctuation in resistance value R e ff with fluctuation in process and temperature is suppressed by the current source 1 30 and the voltage source 140.
  • Expression (13) does not include the threshold voltage V T s- More specifically, due to the action of the current source 130, the influence of fluctuation in process on the resistance value R e ff is suppressed. However, Expression (13) still includes temperature T. In this embodiment, with the action of the voltage source 140, fluctuation in resistance value R e ff with fluctuation in temperature is suppressed.
  • the resistance value R eff may be expressed by Expression (18).
  • Expression (16) and Expression (19) do not include the threshold voltage V T s and temperature T. Accordingly, in the pseudo resistance circuit 100 shown in Fig. 1 , fluctuation in resistance value R e ff with fluctuation in process and temperature is suppressed by the current source 130 and the voltage source 140.
  • the current generation in the current source 130 and the current source 250 is performed based on the same current source 21 0. Accordingly, as shown in Expression (1 9), it is possible to adjust the resistance value R eff by the resistance ratio and the current ratio in the current source 1 30 and the current source 250.
  • FIG. 5 is a diagram illustrating an example of a charge detection circuit according to an exemplary embodiment.
  • a charge detection circuit 500 includes the pseudo resistance circuit 1 00 shown in Fig. 1 , an operational amplifier 51 0, and a capacitor 520.
  • the operational amplifier 51 0 is configured such that the non- inverting input terminal is grounded, and an electric charge Q
  • N is, for example, an electric charge which is output from a sensing element.
  • the pseudo resistance circuit 100 is connected between the output terminal and the inverting input terminal of the operational amplifier 51 0.
  • the capacitor 520 is connected in parallel with the pseudo resistance circuit 1 00.
  • the charge detection circuit 500 outputs an output voltage V 0 UT according to the electric charge Q
  • the pseudo resistance circuit 1 00 uses a weak inversion region of a MOSFET making it possible for the resistance value of the pseudo resistance circuit 1 00 to be a large value of, for example, about 1 0 ⁇ . Accordingly, the charge detection circuit 500 is suitable for detecting a signal having a

Abstract

A pseudo resistance circuit is disclosed that is capable of suppressing fluctuation in resistance value with fluctuation in process or temperature and facilitating adjustment. The pseudo resistance circuit includes a first MOSFET, a second MOSFET, a first current source which generates a first current substantially proportional to absolute temperature, and voltage source which generates a first voltage, which is a substantially linear function of absolute temperature. The gate of the first MOSFET and the gate of the second MOSFET are connected together, the second MOSFET is diode-connected, the first current is supplied to the drain of the second MOSFET, the first voltage is applied to the source of the second MOSFET, and a resistor having a resistance value according to the gate voltage of the first MOSFET is formed between the drain and the source of the first MOSFET.

Description

PSEUDO RESISTANCE CIRCUIT AND CHARGE DETECTION CIRCUIT
FIELD OF THE INVENTION
[0001] The present invention relates to a pseudo resistance circuit and a charge detection circuit.
BACKGROUND OF THE INVENTION
[0002] As a sensor that is mounted in an electronic apparatus, a sensor that uses a charge detection circuit configured to output a voltage according to an electric charge output from a sensing element is known. For example, Patent Document 1 discloses a charge detection circuit in which a capacitor and a resistor connected in parallel are provided between an output terminal and an input terminal of an operational amplifier.
[0003] In a sensor using this charge detection circuit, in order to detect a signal having a comparatively low frequency (for example, about several mHz to several Hz), such as a biological signal, it is necessary to lower the cutoff frequency of a high-pass filter by a capacitor and a resistor. That is, it is necessary to increase the resistance value of the resistor (for example, to about 10 ΤΩ).
[0004] When increasing the resistance value of the resistor, the use of a typical resistive element is not practical in terms of circuit size. Accordingly, for example, Patent Document 2 discloses a configuration in which a weak inversion region of a MOSFET is used to form a resistor having a large resistance value. [0005] However, one drawback when realizing a resistor using a weak inversion region of a MOSFET is that the resistance value fluctuates largely with fluctuation in process or temperature. For this reason, in realizing a resistor using a weak inversion region of a MOSFET, it is necessary to suppress the influence of fluctuation in process or temperature. For example, Patent
Document 3 discloses a configuration in which the gate voltage of a MOSFET is adjusted using a plurality of current sources having temperature dependence, thereby suppressing temperature dependence of the drain current of the MOSFET.
[0006] Patent Document 1 : Japanese Patent Application Laid-Open No. 2008-224230
[0007] Patent Document 2: International Publication No. 95/25349
[0008] Patent Document 3: PCT Japanese Translation Patent
Publication No. 8-509312
[0009] In the configuration disclosed in Patent Document 3, in order to suppress temperature dependence of the drain current of the MOSFET, it is necessary to accurately set a plurality of parameters experimentally found, and adjustment is difficult.
SUMMARY OF THE INVENTION
[0010] The invention described herein has been accomplished in consideration of the limitations of the prior art, and an object of the invention is to provide a pseudo resistance circuit capable of suppressing fluctuation in resistance value with fluctuation in process or temperature and facilitating adjustment. [0011] Accordingly, a pseudo resistance circuit according to an aspect of the invention is described that includes a first MOSFET, a second MOSFET, a first current source which generates a first current substantially proportional to absolute temperature, and a voltage source which generates a first voltage, which is a substantially linear function of absolute temperature, in which the gate of the first MOSFET and the gate of the second MOSFET are connected together, the second MOSFET is diode-connected, the first current is supplied to the drain of the second MOSFET, the first voltage is applied to the source of the second MOSFET, and a resistor having a resistance value according to the gate voltage of the first MOSFET is formed between the drain and the source of the first MOSFET.
[0012] According to the disclosure herein, it is possible to provide a pseudo resistance circuit capable of suppressing fluctuation in resistance value with fluctuation in process or temperature and facilitating adjustment.
BRIEF DESCRIPTION OF THE DRAWINGS
[0013] Fig. 1 is a diagram illustrating a configuration example of a pseudo resistance circuit according to an embodiment of the invention.
[0014] Fig. 2 is a diagram illustrating configuration examples of a current source and a voltage source of the circuit shown in Fig. 1 .
[0015] Fig. 3 is a diagram illustrating a resistance value when focusing only on an N-channel MOSFET.
[0016] Fig. 4 is a diagram illustrating a resistance value when focusing on an N-channel MOSFET and a current source. [0017] Fig. 5 is a diagram illustrating a configuration example of a charge detection circuit according to an embodiment of the invention.
[0018] It is noted that the figures are not necessarily drawn to scale and that elements of similar structures or functions are generally represented by like reference numerals for illustrative purposes throughout the figures. It also should be noted that the figures are only intended to facilitate the description of the various embodiments described herein. The figures do not describe every aspect of the teachings disclosed herein and do not limit the scope of the claims.
DETAILED DESCRIPTION OF THE EXEMPLARY EMBODIMENTS
[0019] In the following description, for purposes of explanation only, specific nomenclature is set forth to provide a thorough understanding of the various embodiments described herein. However, it will be apparent to one skilled in the art that these specific details are not required to practice the concepts described herein.
[0020] Fig. 1 is a diagram illustrating a configuration example of a pseudo resistance circuit according to an embodiment of the invention. A pseudo resistance circuit 100 includes N-channel MOSFETs 1 10 and 120, a current source 130, and a voltage source 140.
[0021] The N-channel MOSFET 1 10 (second MOSFET) is diode- connected, and the gate thereof is connected to the gate of the N-channel MOSFET 120. A current I PTAT from the current source 130 is supplied to the drain of the N-channel MOSFET 1 10. A voltage Vbias from the voltage source 140 is applied to the source of the N-channel MOSFET 1 10. [0022] The gate of the N-channel MOSFET 1 20 (first MOSFET) is connected to the gate of the N-channel MOSFET 1 1 0. In the pseudo resistance circuit 1 00, the N-channel MOSFET 1 20 operates in a weak inversion region, whereby a resistor having a resistance value Reff according to a gate voltage VG is formed between the drain and the source of the N-channel MOSFET 1 20.
[0023] The current source 1 30 generates the current IPTAT (first current) substantially proportional to absolute temperature. A configuration example of the current source 1 30 will be described below.
[0024] The voltage source 140 generates the voltage Vbias (first voltage), which is a substantially linear function of absolute temperature. In this embodiment, if the source voltage VS of the N-channel MOSFET 1 20 = VCM, the relationship of Vbias = CM - A · T is established. Here, A is a constant, and T is absolute temperature. A configuration example of the voltage source 140 will be described below.
[0025] Fig. 2 is a diagram illustrating configuration examples of the current source 1 30 and the voltage source 140 of the circuit 1 00 shown in Fig. 1 .
[0026] As shown, the current source 1 30 includes a current source 21 0 and a P-channel MOSFET 220. In the current source 130, the current IPTAT is output from the drain of the P-channel MOSFET 220.
[0027] The current source 210 (third current source) includes N-channel MOSFETs 230 and 231 , P-channel MOSFETs 232 and 233, and a resistor 234. An output current of the current source 210 is a current IDS2 (third current) of the N-channel MOSFET 231 . [0028] As further shown, the N-channel MOSFET 230 is diode- connected, and the source thereof is grounded. The gate of the N-channel MOSFET 231 is connected to the gate of the N-channel MOSFET 230, and the source of the N-channel MOSFET 231 is grounded through the resistor 234. The size ratio of the N-channel MOSFETs 230 and 231 is, for example, 1 :nPTAT-
[0029] The P-channel MOSFET 232 is configured such that a power supply voltage VDD is applied to the source, the drain is connected to the drain of the N-channel MOSFET 230, and the gate is connected to the gate of the P- channel MOSFET 233. The P-channel MOSFET 233 is diode-connected and is configured such that the power supply voltage VDD is applied to the source, and the drain is connected to the drain of the N-channel MOSFET 231 . The P- channel MOSFET 220 is configured such that the power supply voltage VDD is applied to the source, and the gate is connected to the gate of the P-channel MOSFET 233. The size ratio of the P-channel MOSFETs 232, 233, and 220 is, for example, 1 : 1 : 1/n.
[0030] In the current source 1 30, the gate-source voltage VGsi of the N- channel MOSFET 230 is expressed by Expression (1 ).
[Equation 1 ]
Figure imgf000007_0001
[0031] Here, k is a Boltzmann constant, T is absolute temperature, q is an electronic charge, and κ is a κ approximated parameter. lDsi is a current which flows in the N-channel MOSFET 230, and l0si is a current according to the size of the N-channel MOSFET 230. [0032] The voltage VGsi is also the gate voltage of the N-channel MOSFET 231 and can be thus expressed by Expression (2).
[Equation 2]
V = V + 1 R
(2)
[0033] Here, VGs2 is the gate-source voltage of the N-channel MOSFET 231 . IDS2 is a current which flows in the N-channel MOSFET 231 , that is, an output current of the current source 21 0. RPTAT is the resistance value of the resistor 234.
[0034] Expression (3) is derived from Expressions (1 ) and (2).
[Equation 3]
Figure imgf000008_0001
Here, los2 is a current according to the size of the N-channel
[0036] IDS2 is expressed by Expression (4).
[Equation 4]
Figure imgf000008_0002
[0037] In the current source 1 30, a current which flows in the N-channel MOSFET 231 is lDS2. The P-channel MOSFET 220 is connected to the P- channel MOSFET 233 in a current mirror configuration, and thus the current ΙρτΑτ is expressed by Expression (5).
[Equation 5]
Figure imgf000009_0001
[0038] Here, B is a constant. From Expression (5), the current IPTAT which is output from the current source 130 is a current which is substantially proportional to absolute temperature.
[0039] The voltage source 140 includes a resistor 240 and a current source 250. In the voltage source 140, the voltage Vbias is output between the resistor 240 and the current source 250.
[0040] The resistor 240 (first resistor) is configured such that a voltage VCM (second voltage: the substantially same voltage as the source voltage of the N-channel MOSFET 120) is applied to one end, and the other end is connected to the drain of the N-channel MOSFET 261 .
[0041 ] As further shown, the current source 250 (second current source) includes N-channel MOSFETs 260 and 261 , and a P-channel MOSFET 262. In the current source 250, a current which flows in the N-channel MOSFET 261 becomes an output current IPTAT2 (second current).
[0042] The N-channel MOSFET 260 is diode-connected and is configured such that the drain is connected to the drain of the P-channel MOSFET 262, and the source is grounded. The N-channel MOSFET 261 is configured such that the gate is connected to the gate of the N-channel MOSFET 260, and the source is grounded. The size ratio of the N-channel MOSFETs 260 and 261 is, for example, 1 :1/nbias.
[0043] The P-channel MOSFET 262 is configured such that the power supply voltage VDD is applied to the source, and the gate is connected to the gate of the P-channel MOSFET 233. The size ratio of the P-channel MOSFETs 233 and 262 is, for example, 1 :1 .
[0044] Similarly to the current source 130, the current source 250 generates the current IPTAT2 substantially proportional to the absolute
temperature. In this embodiment, IPTAT2 = (1 / n ias)lDS2- Accordingly, if the resistance value of the resistor 240 is Rbias, the voltage Vbias is expressed by Expression (6).
[Equation 6]
Figure imgf000010_0001
~ A ' T
[0045] Here, A is a constant.
[0046] Next, the resistance value Reff in the pseudo resistance circuit 100 shown in Fig. 1 will be described.
[0047] First, as shown in Fig. 3, description will be provided focusing only on the N-channel MOSFET 120. When the N-channel MOSFET 120 operates in a weak inversion region, a current lDs which flows in the N-channel MOSFET 120 is expressed by Expression (7).
[Equation 7]
Figure imgf000011_0001
[0048] Here, VGs is the gate-source voltage of the N-channel MOSFET 120, and VDs is the drain-source voltage of the N-channel MOSFET 120. los is a current according to the size of the N-channel MOSFET 120 and is expressed by Expression (8).
[Equation 8]
Figure imgf000011_0002
[0049] Here, μ is electron mobility, Cox is oxide capacity per unit area, W is a channel width, L is a channel length, and Ksa is a κ approximated parameter in a weak inversion region. VTs is a threshold voltage.
[0050] From Expressions (7) and (8), the resistance value Reff between the drain and the source of the N-channel MOSFET 120 is expressed by Expression (9).
[Equation 9]
Figure imgf000011_0003
... (9) [0051] Expression (9) includes temperature T. Expression (9) also includes a threshold voltage VTs which fluctuates with a process. Accordingly, in the pseudo resistance circuit 1 00 of this embodiment, as described below, fluctuation in resistance value Reff with fluctuation in process and temperature is suppressed by the current source 1 30 and the voltage source 140.
[0052] First, as shown in Fig. 4, description will be provided focusing on the action of the current source 1 30. When the N-channel MOSFET 1 20 operates in a weak inversion region, the voltage VG is expressed by Expression (1 0).
[Equation 1 0]
Figure imgf000012_0001
[0053] In Expression (7), since VGs = VG - VCM, if VG of Expression (10) is substituted in Expression (7), the current lDS is expressed by Expression (1 1 ).
[Equation 1 1 ]
*DS = }?TAT exp
Figure imgf000012_0002
[0054] From Expression (1 1 ), the resistance value Reff is expressed by Expression (1 2).
[Equation 1 2]
Figure imgf000012_0003
. .. (1 2) [0055] If the current IPTAT of Expression (5) is substituted in Expression (12), the resistance value Reff is expressed by Expression (13).
[Equation 13]
Figure imgf000013_0001
[0056] Expression (13) does not include the threshold voltage VTs- More specifically, due to the action of the current source 130, the influence of fluctuation in process on the resistance value Reff is suppressed. However, Expression (13) still includes temperature T. In this embodiment, with the action of the voltage source 140, fluctuation in resistance value Reff with fluctuation in temperature is suppressed.
[0057] If Vbias of Expression (6) is substituted in Expression (13), the resistance value Reff is expressed by Expression (14).
[Equation 14]
Figure imgf000013_0002
[0058] Here, in the N-channel MOSFET 120, Expression (15) is assumed.
[Equation 15]
υύ ... (15) [0059] Accordingly, from Expression (14) and Expression resistance value Reff is expressed by Expression (16).
[Equation 16]
Figure imgf000014_0001
[0060] The voltage Vbias can be expressed by Expression
[Equation 17]
Figure imgf000014_0002
[0061] Accordingly, considering Expression (5) and Expression (17), the resistance value Reff may be expressed by Expression (18).
[Equation 18] hi(nPTAT)
Figure imgf000014_0003
(18)
[0062] Then, applying Expression (15), the resistance value Reff can be expressed by Expression (19).
[Equation 19]
Figure imgf000015_0001
[0063] Expression (16) and Expression (19) do not include the threshold voltage VTs and temperature T. Accordingly, in the pseudo resistance circuit 100 shown in Fig. 1 , fluctuation in resistance value Reff with fluctuation in process and temperature is suppressed by the current source 130 and the voltage source 140.
[0064] As described above, in the pseudo resistance circuit 100 of this embodiment, as shown in Expression (13), it is possible to suppress fluctuation in resistance value Reff with fluctuation in process by the current source 130 which generates the current IPTAT substantially proportional to absolute temperature and the voltage source 140 which generates the voltage Vbias, which is a substantially linear function of absolute temperature.
[0065] In the pseudo resistance circuit 100 of the exemplary embodiment as shown in Fig. 1 , the voltage Vbias generated by the voltage source is substantially equal to the source voltage of the N-channel MOSFET 120 at absolute zero (that is, Vbias = VCM - A · T), whereby it is possible to suppress fluctuation in resistance value Reff with fluctuation in temperature.
[0066] Accordingly, in the pseudo resistance circuit 100, in order to suppress fluctuation in resistance value Reff with fluctuation in process or temperature, it is not necessary to accurately set a plurality of parameters experimentally found, and adjustment is facilitated.
[0067] In the pseudo resistance circuit 100 of the exemplary
embodiment, the current generation in the current source 130 and the current source 250 is performed based on the same current source 21 0. Accordingly, as shown in Expression (1 9), it is possible to adjust the resistance value Reff by the resistance ratio and the current ratio in the current source 1 30 and the current source 250.
[0068] Fig. 5 is a diagram illustrating an example of a charge detection circuit according to an exemplary embodiment. A charge detection circuit 500 includes the pseudo resistance circuit 1 00 shown in Fig. 1 , an operational amplifier 51 0, and a capacitor 520.
[0069] The operational amplifier 51 0 is configured such that the non- inverting input terminal is grounded, and an electric charge Q|N is input to the inverting input terminal. The electric charge Q|N is, for example, an electric charge which is output from a sensing element. The pseudo resistance circuit 100 is connected between the output terminal and the inverting input terminal of the operational amplifier 51 0. The capacitor 520 is connected in parallel with the pseudo resistance circuit 1 00.
[0070] The charge detection circuit 500 outputs an output voltage V0UT according to the electric charge Q|N input to the inverting input terminal from the output terminal of the operational amplifier 51 0. In the charge detection circuit 500, the pseudo resistance circuit 1 00 uses a weak inversion region of a MOSFET making it possible for the resistance value of the pseudo resistance circuit 1 00 to be a large value of, for example, about 1 0 ΤΩ. Accordingly, the charge detection circuit 500 is suitable for detecting a signal having a
comparatively low frequency, such as a biological signal. As described above, in the pseudo resistance circuit 1 00, fluctuation in resistance value with fluctuation in process or temperature is suppressed. Accordingly, it becomes possible to suppress fluctuation in the output voltage of the charge detection circuit 500 with fluctuation in process or temperature.
[0071] Although various embodiments have been described with respect to specific examples and subsystems, it will be apparent to those of ordinary skill in the art that the embodiment is simply for ease of understanding of the invention, and is not in any way to be construed as limiting the invention. The invention may be altered or improved without departing from the spirit and encompass equivalents thereof.
[0072] Description of Reference Numerals 100: pseudo resistance circuit 1 10, 120, 230, 231 , 260, 261 : N-channel MOSFET 130, 210, 250: current source 140: voltage source
220, 232, 233, 362: P-channel MOSFET
234, 240: resistor
500: charge detection circuit
510: operational amplifier
520: capacitor

Claims

1 . A pseudo resistance circuit comprising:
a first MOSFET having a drain, a source and a gate;
a second MOSFET having a drain, a source and a gate that is coupled to the gate of the first MOSFET, the second MOSFET being diode-connected; a first current source coupled to the drain of the second MOSFET and configured to generate a first current substantially proportional to absolute temperature; and
a voltage source coupled to the source of the second MOSFET and configured to generate a first voltage, which is a substantially linear function of absolute temperature,
wherein a resistor is formed between the drain and the source of the first MOSFET that has a resistance value based on the gate voltage of the first MOSFET.
2. The pseudo resistance circuit according to claim 1 , wherein the first voltage generated by the voltage source is substantially equal to the source voltage of the first MOSFET at absolute zero.
3. The pseudo resistance circuit according to claim 2, wherein the voltage source includes:
a first resistor having a first end and a second end where a second voltage is applied to the first end of the first resistor; and
a second current source coupled between the second end of the first resistor and ground, the second current source being configured to generate a second current that is substantially proportional to absolute temperature.
4. The pseudo resistance circuit according to claim 3, wherein the voltage source is configured to output the first voltage on the second end of the first resistor.
5. The pseudo resistance circuit according to claim 4,wherein the first current source includes a third current source configured to generate a third current substantially proportional to absolute temperature.
6. The pseudo resistance circuit according to claim 5, wherein the first current source generates the first current based on the third current.
7. The pseudo resistance circuit according to claim 6, wherein the second current source generates the second current based on the third current.
8. The pseudo resistance circuit according to claim 7, wherein the second current source comprises:
a third MOSFET having a drain, a source and a gate;
a fourth MOSFET that is diode connected with a drain coupled to the drain of the third MOSFET and a source coupled to ground; and
a fifth MOSFET with gate coupled to a gate of the fourth MOSFET, a drain coupled to the second end of the first resistor, and a source coupled to ground.
9. The pseudo resistance circuit according to claim 1 , wherein the first current source comprises:
a third MOSFET having a drain, a source and a gate; a fourth MOSFET having a drain, a source and a gate;
a fifth MOSFET having a drain, a source and a gate; and
a sixth MOSFET having a drain, a source and a gate.
10. The pseudo resistance circuit according to claim 9, wherein a power supply voltage is applied to the source of the third MOSFET.
1 1 . The pseudo resistance circuit according to claim 10, wherein the fourth MOSFET is diode connected with the drain of the fourth MOSFET coupled to the drain of the third MOSFET.
12. The pseudo resistance circuit according to claim 1 1 , wherein the fifth MOSFET is diode connected with the power supply voltage applied to the source of the fifth MOSFET and the gate of the fifth MOSFET coupled to the gate of the third MOSFET.
13. The pseudo resistance circuit according to claim 12, wherein the drain of the sixth MOSFET is coupled to the drain of the fifth MOSFET, the gate of the sixth MOSFET is coupled to the gate of the fourth MOSFET, and the source of the sixth MOSFET is coupled to a first resistor that is coupled to ground.
14. A charge detection circuit comprising:
the pseudo resistance circuit according to claim 1 ;
a capacitor connected in parallel with the resistor of the pseudo resistance circuit; and
an operational amplifier having an output terminal coupled to a first end of the resistor and to a first end of the capacitor and an inverting input terminal coupled to a second end of the resistor and to a second end of the capacitor.
15. The charge detection circuit according to claim 14, wherein a voltage, based on an electric charge input to the inverting input terminal of the operational amplifier, is output from the output terminal of the operational amplifier.
16. The charge detection circuit according to claim 14, wherein a non- inverting input of the operational amplifier is coupled to ground.
PCT/US2014/061669 2014-10-22 2014-10-22 Pseudo resistance circuit and charge detection circuit WO2016064380A1 (en)

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