Abstract
Pure Bi was rapidly solidified using melt-spinning technique and was alloyed with low concentrations of Sn (1, 2, 3, and 4 wt.%). X-ray diffraction analysis (XRDA), differential thermal analysis (DTA), and temperature dependence of resistivity (TDR) were performed. The resistivity was increased largely, also zero and negative temperature coefficients of resistivity (TCR) were obtained. An intermediate phase SnBi was formed which was not usually obtained under equilibrium conditions, or by rapid solidification using gun technique.
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Kamal, M., El-Ashram, T. Zero and negative temperature coefficients of resistivity of rapidly solidified Bi–Sn alloys using melt-spinning technique. J Mater Sci: Mater Electron 19, 91–96 (2008). https://doi.org/10.1007/s10854-007-9315-4
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DOI: https://doi.org/10.1007/s10854-007-9315-4