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Implantable Device Fabrication and Packaging

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Handbook of Neuroengineering

Abstract

Neural implants are developed with regard to the general aspects of active implant design, packaging philosophies, and decisions on manufacturing methods. The focus of this chapter “Implantable Device Fabrication and Packaging” is laid on reliability of assembly and packaging concepts rather than on the details of how different devices could be developed best. The basic concepts of packaging are introduced that go back to the 1970s but are still fundamental to modern neural implants. Packaging and encapsulation are complemented by connectors, cables, and electrode arrays to cover the main building blocks of neural implants. Manufacturing methods span the scales from precision mechanics to the micromachining level. They are introduced on a fundamental level to help the reader select and combine system components on the way to robust and reliable implants. Foundations are complemented by recent reviews to guide readers deeper into the different topics and mirror developments against transferability and applicability in clinical settings.

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Abbreviations

AIMD:

Active implantable medical device

ALD:

Atomic layer deposition

ASIC:

Application-specific integrated circuit

CAD:

Computer-aided design

CAM:

Computer-aided manufacturing

CE:

Conformité Européenne

CT:

Computed tomography scan

DBS:

Deep brain stimulation

ECoG:

Electrocorticography

EDP:

Ethylene pyrocatechol

FDA:

Food and Drug Administration

FEP:

Fluorinated ethylene propylene

FPGA:

Field-programmable gate array

HTCC:

High temperature co-fired ceramics

IC:

Integrated electronic circuit

IDE:

Investigational device exemption

IPG:

Implantable pulse generator

IrOx:

Iridium oxide

LCP:

Liquid-crystal polymer

LTCC:

Low temperature co-fired ceramics

MDR:

Medical Device Regulation

MEMS:

Microelectromechanical systems

MIL-STD:

Military standard

MRI:

Magnetic resonance imaging

OHCI:

Occult hepatitis C viral infection

PDMS:

Polydimethylsiloxane

PEI:

Polyesterimide

PMA:

Premarket approval

PtIr:

Platinum-iridium alloy

RF:

Radio frequency

RIE:

Reactive ion etching

RTV:

Room temperature vulcanizing

SIROF:

Sputtered iridium oxide

SMD:

Surface mount devices

SSED:

Summary of Safety and Effectiveness Data

TRL:

Technology readiness level

UEA:

Utah electrode array

USP:

US Pharmacopeia

WVTR:

Water vapor transmission rate

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  1. Laboratory for Biomedical Microtechnology, Department of Microsystems Engineering-IMTEK, IMBIT//BrainLinks-BrainTools Center & Bernstein Center Freiburg, Albert-Ludwig-University of Freiburg, Freiburg, Germany

    Thomas Stieglitz

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    Nitish V. Thakor

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    Nuan Chen Ph.D

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Stieglitz, T. (2021). Implantable Device Fabrication and Packaging. In: Thakor, N.V. (eds) Handbook of Neuroengineering. Springer, Singapore. https://doi.org/10.1007/978-981-15-2848-4_102-1

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